1. Serving as the primary engineering interface with customer during product development; 2. Responsible for delivering products on schedule; 3.Facilitating risk management; 4. Communicating status and issues to customer;• 5.Understand technical issues and drive them to closure; 6.Work with vendors to drive material to support engineering building。

1.BS degree ME/EE/IE or physics required 2.At least 5+ years of experience in IC packaging and assembly including 2+ years as a team lead or manager; 3.Experience in assembly process including SMT, die attach, flip chip, underfill, molding, singulation; 4.Critical thinking and problem solving skills ; Planning and organizing ; Decision making ; 5.Exceptional listening, presentation and communication skills； 6.Fluent in English and Chinese。