Ong Kok Seng
MaleProduction Operation ManagementLive in MalaysiaNationality Malaysia
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Work experience
Engineering Manager
Micron Technology
2023.01-Current(2 years)
Assembly process engineering manager of Micron Memory Penang Component Assembly. Responsible for CR2 process which including substrate laser mark, substrate epoxy printing, die attach and wire bond.
Engineering Manager
Osram Opto Semiconductor (M) Sdn Bhd
2014.01-2023.01(9 years)
Career History and Work Experience:
Brief Description of Function:
1. As FOL/EOL process section head in an automotive LED production line with direct report of 4 engineers each for FOL and EOL.
2. Process covered FOL process (Die attach - glue and eutectic, wire bond), EOL process (Platelet Attach, Silicone Casting/Dispensing and molding)
3. Expert in silicone/phosphors casting and compression molding.
4. As key contact person for new product and early involvement with RnD on new product introduction and phase in.
5. Drive assembly yield improvement for FY16/17 especially significant improvement in layer transfer and TiO2 casting process.
Senior Service Engineer
Kestronics (M) Sdn Bhd
2004.06-2014.01(10 years)
Brief Description of Function:
1. Perform installation and setup KLA-Tencor ICOS vision inspection machine (wafer and component level) on customer site (Multinational corporation in Malaysia and Thailand which are Intel, AMD, ASE, Avago, IDT, Sony and more.). Assist Avago/Inari to transform from wafer manual inspection to full AVI successfully.
2. Perform installation and setup ACCULOGIC Flying Probe tester and In-circuit fixture-based testers.
3. Provide guidance on machine evaluation and internal qualification buy off, assist customer on process control and work withR&Dteams to solve customer issue.
4. Response to equipment major down call from customer. Perform major preventive maintenance on annual and bi-annual PM
5. Conduct trainings on equipment operation, application and maintenance.
Senior Technician
Advanced Micro Devices Export Sdn Bhd / Spansion (M) Sdn Bhd
1998.04-2004.06(6 years)
Brief Description of Function:
1. Equipment maintenance in Mark and Pack department which consists of laser marking, vision inspection and packing equipment.
2. Perform preventive maintenance & 5S for line equipment. Setup machine for new products or conversion. Troubleshoot machine problem and handle production issue.
3. Assist engineer in process control.
References:
1. Name : Lam Lih Siang
Tel. (Mobile) : 012-5316616
2. Name : Teh Seak Chuan
Tel. (Mobile) : 012-5836291
Educational experience
University of Northumbria, United Kingdom
Electronics
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