Erwei

Team Lead
Male24 y/oSemiconductor product engineerLive in United StatesNationality China
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Work experience

Master of Engineering Student

UM
2024.08-Current(9 months)
Master of Engineering | Electrical and Computer Engineering | MEMS and Microsystems

Projects

Temperature‐Insensitive SOI DETF‐Resonant MEMS Accelerometer

Team Lead
2025.01-Current(4 months)
• Performing COMSOL Multiphysics simulations to characterize and optimize SOI-based DETF resonator designs, achieving a resonant frequency of 82 kHz, scale factor of 104 Hz/g, minimizing non-linearity to approximately 0.000113%, and thermal-mechanical noise at 27 ng/√Hz. • Simulated substrate-induced stresses (SOG and SOI) and thermal effects due to anodic bonding, achieving intrinsic thermal drift as low as 3.045μg/K, and packaging-induced drift as low as 2.15μg/K via passive compensation techniques. • Simulated substrate-induced stresses and packaging effects, achieving intrinsic thermal drift as low as 3.045 μg/K and further reducing packaging-induced drift to 2.15 μg/K by leveraging CTE mismatch engineering for passive thermal stress compensation. • Implemented folded-beam compliant anchors and multi-anchor floating frame structures to absorb thermomechanical stress, enhancing both thermal stability and mechanical shock resistance (>2000 g Y/Z, 500 g X).

High‐Sensitivity SOG Comb‐Drive Capacitive MEMS Accelerometer

Team Lead
2025.01-Current(4 months)
• Managing the project timeline, setting milestones, assigning tasks, and leading weekly meetings to track team progress. • Designed two SOG comb‑drive capacitive sensing variants: 0.10 pF/g version compatible with probe‑station electrostatic‑force actuation testing (non‑linearity: 0.72%), and 0.20 pF/g version optimized for higher sensitivity (non‑linearity: 1.71%). • Iteratively improved design to guarantee ≤ 0.99 µm displacement accuracy over a ±20 g full‑scale range, and integrated electrostatic actuation compatibility for lab evaluation. • Developed models in MATLAB and COMSOL to predict and validate capacitance variation, displacement response, nonlinearity, electrostatic force actuation and resonance frequency; achieved > 90 % agreement with probe‑station measurements.

Smart Rain Barrel Capstone Project/ RU / Capstone Project

First Author
2022.09-2023.08(a year)
• Engineered the hardware design for the Smart Rain Barrel Network (SRBN), integrating an adjustable power supply system with linear voltage regulation to safeguard the electronic valve controls. • Deployed smart rain barrels with IoT capabilities, using the Blynk platform for real-time data management on water levels, turbidity, and temperature metrics. • Authored the research paper titled "Design and Implementation of a Smart Rain Barrel Network via the Blynk IoT Platform," which was selected for presentation and published in the proceedings of the 2024 IEEE International Conference on Consumer Electronics (ICCE 2024).

Educational experience

University of Michigan- Ann Arbor

Electrical and Computer Engineering | MEMS and Microsystems
2024.08-Current(9 months)
Coursework: Integrated Microsystems, Integrated Microsystems Laboratory, BioMEMS, Introduction to MEMS

Rutgers University- New Brunswick

Electrical and Computer Engineering
2019.09-2023.12(4 years)
Coursework: Analog Electronics, VLSI Design, Digital Electronics

Languages

English
Proficient
Chinese (Mandarin)
Native
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