1. Be responsible for risk assessment / verification and related engineering activities in the process of mass production and introduction of new products, and ensure the manufacturability and reliability of products 2. Be responsible for the monitoring, analysis, positioning and improvement of engineering problems in the packaging process, and continuously improve the packaging engineering capability 3. Be responsible for solving the abnormal process of mass production products, and ensure that the CT, yield and reliability of products meet the requirements of customers 4. Responsible for team KPI development and assessment, and inter departmental coordination

1. Bachelor degree or above, majoring in microelectronics and other science and engineering related majors 2. At least five years of practical engineering experience in packaging production line, more than two years of team management experience, knowledge of wafer level packaging technology is preferred 3. Familiar with quality management requirements and SPC control plan system 4.Good oral English