Primary Roles: Lead a team of process and equipment engineers to deliver key matrices and drive organizational success. Lead entire front end operation: Wafer grinding, Slicing, Parting, Fine Polishing, Encapsulation and Wire bonding. Lead factory Yield improvement, cost reduction, quality enhancement and process development. Responsibilities: Daily review process and equipment key matrices in operation meeting with team and other functions. Support production planning and manufacturing to meet cost, delivery and quality targets. Resolve excursions, issues and provide recovery plan to meet high volume manufacturing environment requirements. Maintain and improve critical process parametric with EDCSPC and in house developed monitoring system. Coordinate process changes and process transfer between Penang and Thailand teams. Establish and drive cost reduction, productivity improvement and profitability. Manage staffs performance appraisal, focal adjustment and promotion. Provide improvement plan for low performer. Consolidate weekly report to higher management on project status, closure, achievements and issues. Collaborate with established machine makers: Disco, Okamoto, Veeco, Okano, Ultratech, Nikon and more. Achievements: Pioneered, setup and qualified Green Field Fab from zero to HVM in 8 months from flood recovery. ISO 14001(April ’13) and ISO 9001(Sep ’13) certification. Achieved Best In History Mechanical (99.5%), Inspection (98.4%) and Electrical (97.5%) yield. Achieved Best In History resources planning with 50% lesser IDL cost benchmark to other WD sites. Achieved IDM cost saving > $600K/yr from top 5 items mainly on slicing diamond wheels and gold wire. Transformed daily engineering key matrices review into dashboard methodology. Improved spare parts cost by 82% or >$1.2M/yr for polishing through in house refurbish, local sourcing and TPM. Facilitated Kaizen teams and completed > 20 improvement projects. Conceptualized and implemented multiple automation projects for machining and achieved > 20% headcount saving.

Roles & Responsibilities: Planned, designed and developed Green Field process focus on NVA process elimination, headcount reduction, cost reduction, new fabrication technology and process automation. Achievements: Developed and implemented Encapsulation laminator. Developed and implemented automated bar mount and adhesives fill. Planned and setup Pilot line to simulate NVA process elimination. Assisted WD in flood fighting and planned for fast recovery from 2011 Thailand flood disaster in Ayutthaya.

Roles & Responsibilities: Led Clean Room Bar Assembly, Cleaning, Metrology, HMR & Photolithography engineering teams on AAB fabrication. Chaired Clean Room shop floor team to achieve factory productivity and engineering key matrices. Established & managed yield improvements, process control and process improvements. Integrated new technology and design concept developed by development team. Managed staffs performance appraisal, focal adjustment and promotion. Achievements: Localized Advanced Bar Placement pick and place automation and achieved cost saving > 30%. Implemented feedforward system for bar alignment and photolithography MTB to meet future product roadmap. Co-developed laser ablated AAB with university professor from Germany and China. Eliminated s/steel re-deposition by optimizing photo resist thickness, photo mask design and ion etching process. Implemented pole protection photo mask, TE trim, LE comb and furrow mill to achieve products robustness. Organized technical talks on new technology introduction and process to junior technical personnel. Sourced alternatives burden materials for business continuity and cost saving. Achieved capacity improvement on multiple process tools(e.g. Photo Stepper, Auto Pick & Place)

Seagate Roles & Responsibilities: Led Clean Room Bar Assembly, Cleaning & HMR engineering team. Slider Advanced Manufacturing Development. Achievements: Achieved Best In Class particle reduction through Odd & Even carrier development. Reduced Bar Assembly rework and HMR remount from 12% – 5% and 20% -3% respectively. Setup, transferred and implemented CD SEM, HMR mounting, aqueous + solvent cleaning system. Developed and implemented IDM buyoff system for Clean Room burden materials. Engineered tooling management system.

Seagate Roles & Responsibilities: Collaborated with multiple process owners and worked on improvement projects. Achievements: Completed 8 projects with total saving of USD2.3M utilizing Six Sigma methodology (DMAIC). The projects consist of Stripe Height sigma improvement, Lap plate life improvement, Lapping sensor drop improvement, Lapping hook up sensor improvement, ABL3 capacity improvement, Time-To-Yield improvement and Shop Floor yield improvement. Certified trainer for Green Belt training and coached Green Belt project owners.

Seagate Roles & Responsibilities: Process owner for Lapping, Polishing, Front End Cleaning, Wire Bonding and Lap Plate Preparation Achievements: Transferred 30 Series Lapping/Polishing process from US to Penang. 30 Series process yield improvement from ~30%% to >90% Assisted in transformed 2 heat bending point carrier to 7 actuators bending point carrier with Advanced Bar Lap. Assisted in transformed and implemented 46 actuators bending point carrier in bar lapping Developed in-process margin and upstream process KPIVs characterization.